Product Description

Adopt nanosecond ultraviolet laser(picosecond optional), cold light source, laser cutting heat affected zone is particularly small to 10um;

Focusing sopt can be tailored 10um; suitabl for accurately cuting and drilling of any organic & inorganic materials;

CCD visual pre-scan & automati targe capture positioning, maximum processing range 500mmx600mm, XY platform stitching accuracy less than 5 um;

Support a variety of visual positioning, such as cross, solid circle, hollow circle, L-shaped rectangular edge, sensing images etc.;

It's convenient and fast to use the laser cutting convenient and fast to shorten the delivery time;

Good cutting quality, small deformation, smooth apperance, beautiful;

The combination of numerical control technology, laser technology, software technology and other photoelectric technology, with high precision and flexibility.

Application:

FPC soft board cutting drill

PCB board cutting

Camera module cutting

Fingerprint identification chip cutting 

Semiconductor wafter cutting